Halnziye 1.5g Metal Oxide Thermal CPU Paste for Heatsink

Description: Provide optimal heat transfer between CPU and heatsink through a metal oxide compound - Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage. Please see our support section for the Material Safety Data Sheet for SILVGREASE1. Key Features: Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications Metal-based compound containing metal oxide Thermal conductivity of more than 1.93 W/m-K Negligible electrical conductivity Stable performance over a wide temperature range Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications Metal-based compound containing metal oxide